Mechanical Engineer, Robotics Hardware Intern
About this role
Field AI is hiring a Mechanical Engineer, Robotics Hardware Intern, internship, on-site in Boston, MA, in the ROBOTICS sector.
- Structures: Design and model mechanical structures including external enclosures, internal compute frames, and load-bearing chassis.
- Mounts: Design and validate robust sensor mounts, payload attachment points, and mechanical interfaces.
- Ingress Protection: Implement IP-rated solutions with gaskets, seals, membranes, and coatings to meet water/dust ingress standards.
- Thermal Management: Incorporate thermal mitigation strategies such as fans, heat sinks, conductive paths, and airflow guides.
- Mass & Volume Budgets: Ensure adherence to payload constraints, including tight volumetric envelopes and weight limitations.
- CAD & Simulation: Build detailed SolidWorks CAD assemblies. Run FEA and thermal simulations to validate strength, durability, and heat dissipation.
- Material & Component Selection: Choose materials and components to meet mass, strength, thermal, and manufacturability constraints. Design for Production: Apply DFM, DFA, DFS principles throughout the design lifecycle.
- System Testing: Conduct mechanical load testing (shock, vibration), thermal validation, ingress tests, and sensor alignment assessments.
- Prototyping: Rapidly iterate on prototypes for fit checks, thermal evaluations, and integration trials.
- Documentation & Budgets: Generate mechanical drawings, GD&T annotations, BOMs, and assembly instructions for fabrication and QA. Manage weight, volume, and thermal budgets.
- Build: Work with vendors and contract manufacturers to procure mechanical hardware. Develop QA checks for incoming units. Support payload integration and scaling.
- Debug: Investigate mechanical failures, deformation, and environmental weaknesses during testing and deployments.
- Monitor: Develop protocols for monitoring the system mechanical health and loads.
- Education: Current student pursuing a B.S., M.S., or Ph.D. in Robotics, Mechanical Engineering, Mechatronics, or related field.
- CAD Expertise: Proficient with SolidWorks or equivalent mechanical CAD platforms.
- Thermal & Structural Analysis: Familiarity with FEA and thermal modeling tools.
- Field-Ready Design: Experience designing hardware that survives vibration, shock, thermal cycling, and environmental exposure.
- Manufacturing Knowledge: Experience designing for CNC, sheet metal, additive manufacturing, and assembly workflows.
- Mechanical Systems Integration: Experience working across teams to integrate mechanical systems with compute, sensors, and power electronics.
- Lab Skills: Comfort with mechanical debugging, thermal test setups, vibration tables, and ingress testing.
- Cross Functional Robotic Skills: Ability to contribute electrical, sensing, and embedded computing work to deliver robust integrated systems.
- Scaling: Experience taking systems from prototype to large scale production.
- Field Environments: Experience developing systems for harsh field environments.
- Deployed Robotics: Experience working on robotics deployed in real world settings such as autonomous vehicles, drones, or ruggedized robots.
- Systems Level Robotics: Fluency across mechanical, electrical, and software systems.
- Reliability Engineering: Experience designing to meet IP ratings, MIL-STD, or equivalent ruggedness standards.
Description from Field AI's official posting. Always confirm details on the company careers page.
About Field AI
Field AI
Company in the mobility sector tracked nightly on the Mobility Jobs board.
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About Larry Sherwood Jr.
Talent Acquisition Leader specializing in mobility, EV, and frontier tech. 1,000+ hires across roles ranging from production technicians to VPs, including 48 hires for the AFEELA U.S. launch at Sony Honda Mobility (98% offer acceptance, $1.5M+ agency savings). SHRM-CP certified. Build recruiting functions from scratch, no agencies.
Currently open to senior TA leadership roles in the United States. larrysherwoodjr.com · Resume (PDF)
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