Senior Advanced Manufacturing Engineer

Basic Qualifications

Bachelor's degree in Manufacturing or Industrial Engineering, or a related Science, Engineering or Mathematics field, plus a minimum of 5 years of relevant experience; or Master's degree plus a minimum of 3 years of relevant experience.

CLEARANCE REQUIREMENTS:Applicants selected may be subject to a U.S. Government security investigation and must meet eligibility requirements for access to classified information. Due to the nature of work performed within our facilities, U.S. citizenship is required.

Responsibilities for this Position

General Dynamics Mission Systems is currently seeking an Advanced Manufacturing Engineer in our Bloomington, MN facility.We will rely on your extensive knowledge to develop, implement and maintain methods, operation sequence and processes in the manufacturing or fabrication of parts, components, sub-assemblies and final assemblies. The seasoned, experienced Advanced Manufacturing Engineer we seek will develop manufacturing engineering plans and strategies for specific products and processes and estimate manufacturing costs, determine time standards and make recommendations for tooling and process requirements of new or existing product lines. At GDMS, we continually seek ways to develop and improve manufacturing methods, utilizing our team’s knowledge of product design, materials and parts, fabrication processes, tooling and production equipment capabilities, assembly methods, and quality control standards.

What you’ll experience:

Technologies that aren’t just top-notch, they’re often top-secret

A team of bold thinkers committed to exploring what’s next

Opportunities to gain new knowledge - as it’s discovered

What you bring to the table:

A Bachelor’s degree in Manufacturing or Industrial Engineering, a related specialized area or field (or equivalent experience) plus a minimum of 5 years of relevant experience; or Master's degree plus a minimum of 3 years of relevant experience

Effectively leads quality initiatives using six sigma methodology to determine extent of non-conformance root cause, and corrective action

Fully proficient use and understanding of Design for Manufacture (DFM) concepts, principles, and theories

Fully proficient understanding lean techniques and statistical analysis

Demonstrated experience supporting Surface Mount Technology (SMT) manufacturing processes, including solder paste printing, component placement, reflow, AOI, inspection, and rework

Working knowledge of materials used in electronics assembly, including solder paste, flux, adhesives, epoxies, conformal coatings, underfill, encapsulants, potting compounds, thermal interface materials, and cleaning chemicals

Ability to review and follow material requirements, technical data sheets, handling instructions, cure profiles, shelf-life controls, and environmental-storage requirements

Experience selecting, applying, and troubleshooting assembly materials to ensure product quality, reliability, and manufacturability

Familiarity with material controls such as ESD requirements, moisture sensitivity level (MSL) handling, lot traceability, expiration-date management, and bake-out requirements

Ability to work with Manufacturing Engineering, Quality, and Component Engineering to resolve material-related defects, improve processes, and support new-product introduction activities

What sets you apart:

Creative, innovative responsibilities requiring advanced decision-making skills

Team player who thrives in collaborative environments and revels in team success, meeting and exceeding personal and team commitments

Commitment to ongoing professional development

Keeps abreast of technology trends

Identifies opportunities to apply AI for continuous improvement and innovation

Experience programming, troubleshooting, or supporting equipment from manufacturers such as Mycronic/Mydata, Fuji, ASM/Siplace, Yamaha, Juki, Koh Young, CyberOptics, or Nordson

Current or prior IPC certification, particularly J-STD-001, IPC-A-610, IPC-7711/7721, or trainer/certified instructor credentials

Strong understanding of electronics assembly materials—including solder paste, flux, adhesives, epoxies, conformal coatings, underfill, encapsulants, potting compounds, and thermal interface materials—and their effects on manufacturing quality and long-term reliability

Ability to interpret engineering drawings, BOMs, assembly instructions, Gerber/ODB++ data, and component datasheets

Experience conducting root-cause analysis and implementing corrective actions for defects such as insufficient solder, bridging, tombstoning, voiding, component misalignment, opens, or missing components

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Salary Note
This estimate represents the typical salary range for this position based on experience and other factors (geographic location, etc.). Actual pay may vary. This job posting will remain open until the position is filled.

Combined Salary Range
USD $111,104.00 - USD $123,257.00 /Yr.

Company Overview

General Dynamics Mission Systems (GDMS) engineers a diverse portfolio of high technology solutions, products and services that enable customers to successfully execute missions across all domains of operation. With a global team of 12,000+ top professionals, we partner with the best in industry to expand the bounds of innovation in the defense and scientific arenas. Given the nature of our work and who we are, we value trust, honesty, alignment and transparency. We offer highly competitive benefits and pride ourselves in being a great place to work with a shared sense of purpose. You will also enjoy a flexible work environment where contributions are recognized and rewarded. If who we are and what we do resonates with you, we invite you to join our high-performance team!